Embedded Files
October Meeting
Welcome / Introduction
by Jim Wilcox
Further Investigation of Double Reflow BGA with Stacked Microvias
by Jeff Kurish
FEM Investigation of BGA Solder Joint Residual Stress as a Function of Solidification Temperature
by Mohammed Abdel Razzaq
Alternative Methods to Measuring BGAs for Thermal Warpage
by Chris Gastaldo
Vibration Fatigue and Shear Strength of High Reliability Solder Alloys
by Joseph Brown
Thermal Cycle Reliability Update: Hybrid Solder Assemblies Using High Reliability Solder Pastes
by Michael Meilunas
Dynamic Alloying of Solder Joints in Low Temperature Solder Assembly of Resistors
by Alyssa Yaeger
Reliability Evaluation of High-Temperature Bonded Interfaces for Automotive Power Electronics
by Paul Paret
Thermal Imaging via Laser Flash Analysis with Spatial Resolution
by Jeff Kurish
Vacuum Reflow of Solder Thermal Interface Materials: Thermal Cycle Stability
by Piyush Kulkarni
Low Temperature Solder Thermal Cycle Experiments with 'Moderate'Electromigration Stressing
by Michael Meilunas
Effect of Temperature and Current Stress on Thermal Cycling Performance of Low Temperature Solder Alloys
by Alyssa Yaeger
Explorations in Electromigration Testing
by Alyssa Yaeger
Interactions Between Cyclic Loading and Electromigration in SAC305 Solder Joints
by Peter Borgesen
Low Temperature Solder Current Stressing Effects on Drop Test Performance 2022-2024 Wrap-Up
by Michael Meilunas
May Meeting
by Jim Wilcox
by Martin Anselm
Temperature Dependence of Solder Joint Vibration Lifetime Testing
by Nithin Lakshminarayan
Capacitance based Measurements for TIM2 Stability Analysis
by Piyush Kulkarni
Solder Thermal Interface Process Optimization
by Ali Davoodabadi
Thermal Imaging for TIM Evaluation during Power Cycling
by Ali Davoodabadi
NIST CHIPS Packaging Metrology Overview
by Christopher Soles
What’s Missing in Your Cure Kinetics Model for Advanced Packaging Materials?
by Ran Tao
Double Reflow BGA Defects with Stacked Microvias
by Jeff Kurish
Accelerated Thermal Cycle Testing Observations
by Michael Meilunas
Embrittlement Due to Gold Surface Finishes in SnPb Joints
by Joseph Brown and Alyssa Yaeger
Copper Diffusion and Oxidation as a Measure of Shelf-Life and Thermal Stability
by Nancy Wang and Alyssa Yaeger
Laser Reflow Thermal Limitations
by Jeff Kurish
Test Component Quality Concerns: An Open Discussion
by Michael Meilunas
High Reliability Solder Device Shear Strength with an Aluminum Clad PCB
by Alyssa Yaeger
Cyclomax (SAC-Q) Drop Shock Performance
by Sufyan Tahat
High Reliability Hybrid Solder Joints—Preliminary Trials
by Michael Meilunas
Optimizing Reliability of Solder Joints Reflowed near or below 140C
by Peter Borgesen
Effect of Electromigration Pre-Stress on Thermal Cycle Lifetime
by Alyssa Yaeger
Current Stress Effects on Drop Shock Performance of SnBi Low Temperature Solder Joints
by Michael Meilunas
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