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June, 2007 Presentations
QFN Process Development and Reliability Project
On the Behavior of Bubbles in Liquids
Voiding in Paste-Only Solder Deposits
Copper Electroplating and Voiding in Cu3Sn
Effects of Microstructure on Lead Free Solder Joint Reliability
Lead Free Solder Joint Fatigue Study
Pb-Free Thermal Cycle Testing Overview
Challenges in Thermal Cycling of Lead Free Solders
Missing Ball and Other Brittle Failures on Ni/Au
Effects of Au on Brittle Failures in Assemblies on Electrolytic Ni/Au
Investigations of Brittle Failure of IMCs on ENIG
Underfill for Lead Free Flip Chips
Reballing Lead Free Components with SnPb
October, 2007 Presentations
Advanced Process Laboratory: Process Research and Support
Pad Cratering: Correlations Between Joint Level and Board Level Testing
CSP Underfill and Edge/Corner Bonding Studies
Intermetallic Formation in the Sn-Cu-Ni System
Brittle Failures of Joints on Electrolytic Ni/Au
Copper Electroplating and Voiding in Cu3Sn: An Update
Preconditioning of Lead Free Solder Joints
Thermal Cycling of Lead-Free Solder
Lead Free FC Thermal Cycling Parameters
Effects of Solder Microstructure on Fatigue
Reliability Test Plans & Schedule
Solder Paste Selection for QFN Assembly
A Rework Process for LGA Components
March, 2008 Presentations
Advanced Process Laboratory/AREA Consortium
Pb Free Solder Alloy Reliability Update
Mixed Solder Alloy Reliability Update
Voiding in Cu3Sn: Why it is Sporadic?
Fine Pitch Flip Chip and TSV Based Die Stacking
Pad Cratering:Relating Pad-Level Testing to Board Level Reliability
Intermetallic Bonds to Ni/Au Pads
CSP Underfill and Edge/Corner Bonding Studies
Cycling Results for Pb-Free Flip Chips with 8 Underfills
Thermal Cycling Test Protocols for Lead-Free Solder
APLWeb Online Registration and Tools
Relationships between Drop Reliability and Energy
Ongoing and Future Repair Projects
Thermal Cycling Test Protocols for Lead-Free Solder
Correlations Between Microstructure and Fatigue Life in Pb Free Solder
Thermal Interface Bondline Assembly
Void nucleation, Growth and Shrinkage in SAC405/Electrodeposited Cu Foil Solder Joints
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