2005 Meetings

June, 2005 Presentations

Inhibiting Voiding in SAC/Cu IMC Structures

Effects of BGA Underfilling on Drop Test Performance

Moisture/Reflow Testing

SnCu Flip Chips

Interfacial Reactions of Sn-Ag-Cu Solders Modified by Zn Addition

Rework Cookbook Update

Wetting, Spreading & Soldering

Effects of No-Pb Rework on 2nd Level Reliability

"Forward Compatible" Solder Joint Reliability

Minimizing Reflow Temperature for Reliable Lead-Free Assembly

Effects of Pre-Assembly Parameters on No-Pb Microstructure and Reliability

Voiding in SAC/Cu IMC Structures

Is Zinc the Solution?

Mechanical Vibration and Shock: Modeling and Measurement

Lead-Free Reflow: PCB Laminate/Prepreg Bonding Evaluation

October, 2005 Presentations

Mechanics of Drop Testing

Loctite Hysol FF2300 No-Flow Underfill

Soldering Gold Bump Flip Chips Wrap-Up

BGA Underfill Evaluation: Medical Device and Standard Product Mechanical Testing I

Cu Plating Study

Chip Cap Cracking in Lead-Free Assemblies

Improving Thermal Interface Bondlines

Voiding in Electrodeposited Copper Foils

How to Eliminate Voiding: Microstructure and Stress

Undercooling of SAC Solder Joints

Mixed Assembly Reliability Testing Update

Smart Protocols for Growth of Epitaxial Metal Films

Copper Screening Test Update

How to Eliminate Voiding: SACZn Solder

Our Current Understanding of Voiding

Voiding and Cu Plating Parameters, Including Chemistry

Voids in Cu3Sn: An Update

Assessing Lead-Free Reliability

Understanding Lead-Free Reliability

Assembly-Induced Defects in Thermal Interfaces

Variability in Lead Free Solder Ball Pull Strength: Effect of Crystal Orientation

The Effect of Voiding on Pull Test Results

Lead-Free Reflow: PCB Dielectric to Pad Adhesion Assessment

Lead-Free PCB Damage: Material Selection

BGA Underfill Evaluation: Medical Device and Standard Product Mechanical Testing II

March, 2006 Presentations

Drop Testing of Lead-Free and Mixed Solder Assemblies

Solder Bump and Pad Pull Testing

DAGE Solder Ball Testing Update

Component Underfilling and Edge/Corner Bonding

Flip Chip Program

HP SAC/Ni Discussion

Rework Cookbook Update: 2005

Process Induced Defects in Thermal Interface Materials

Voiding in Electrodeposited Copper Foils

IMC Problems in SAC/Ni Soldering

Mixed Alloy Testing Update: 2005

QFN/MLF Process Manual Overview

Pb-Free Testing Update: 2005

Microstructure of Mixed Solder Alloys

Voids in Cu3Sn: Review and Update

Solder Pad Finish Issues

Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Materials

Voiding and Intermetallic Strength of SAC Solder on Cu Pads

Solder Bump Pull Test and Shear Fatigue Evaluation of Mixed Solder Mechanical Properties

Lead Free Assembly and PCB Damage [Parts I & II]