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June, 2008 Presentations
Electronics Packaging for Military and Aerospace
Brittle Failure and Spalling on Ni/Au
Thermal Cycling of Lead-Free Solders
'Bump' and RecrystallizationSn
Thermal Cycling Test ProtocolSn
Effects of Dwell in Isothermal Fatigue Testing
Comparison of Pad and Board Level Testing
Development of Micro-Impact Fatigue Testing
Interconnect Stress Testing Results
Pad Cratering in Area Array Repair
The Role of Glass Fibers in Pad Cratering
Fine Pitch Flip Chip Assembly/Au
October, 2008 Presentations
A Case Study of Sproadic Brittle Failure on Ni/Au Surface Finish
Brittle Failures on Ni/Au Finishes: Part II
Package-on-Package Assembly and Reliability Investigation
Lead Free Thermal Cycling Progress<
"High Density" Reliability Test
Pb-Free Laminate Testing and Recommendations
Pad Cratering UpdateSn: An Update
CAF Response to Mechanical Loading
PCB Damage in Area Array Repair: Week 41 Update
Controlling the Rework Profile
Thermal Interface Bondline Assembly
Quantitative Acceleration of Long-Term Agin
Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging
Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling
Paste/Underfill Compatibility Update
Mechanical Test of Edge and Corner Bond Assemblies
Underfill and Solder Joint Loading in Thermal Cyclin
March, 2009 Presentations
Thermal Cycling Induced Microstructure Evolution in Lead Free Solder
Cycling Induced Recrystallization of Lead Free Solder and Why You Should Care
Acceleration of Long Term Aging Effects in Lead Free Solder
The Complete Breakdown of Miner's Rule in Load Controlled Cycling of No-Pb Solder
On the Breakdown of Miner's Rule for Lead Free Solder
Vibration Testing of Multiple Alloys & Pad Finishes
Electrolytic Cu Plating Recommendations
PCB Cook Book Update & Halogen Free PCB Plans
Digital Human Modeling Technology: Overview, Opportunities, and Applications
Adhesion/Cohesion Testing of Underfills and Corner/Edge Bonding Materials
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