Embedded Files
October Meeting
Welcome/Introduction
- By Jim Wilcox
Electromigration Study of Lead-Free Solder Joints
- By Faramarz Hadian
MAT8D. Sulfur Resistor Corrosion: Conformal Coating Mitigation and Supplier Sensitivity
- By Michael Gaynes and Holly Rubin
MAT4D. High Performance Die Level Thermal Interface Materials
- By Divya Choudhary
APD11B. Laser Reflow Fundamentals
- By Luke Wentlent
Flexible Hybrid Electronic Materials
- By Christopher Ober
APD2B. Joining to Flexible Substrates with Asymmetric Heating
- By Peter McClure
APD11. Laser Reflow Application Studies
- By Luke Wentlent
REL9A. Mixed VIPPO Solder Defect Studies
- By Pericles Kondos
Effect of Long Term Aging on the Fatigue Properties of SnAgCu Solder Joints
- By Sa'd Hamasha
REL16A. Die Size Effects on BGA Reliability and Mechanical Modeling Thereof
- By Peter McClure and Mahdi Farahikia
REL17A. System-in-Package Interconnect Reliability - SAC305
- By Michael Meilunas
REL15B,C. Power Cycle Reliability Testing
- By Michael Gaynes
Laser Reflowed Solder Joints / Mechanical Behavior / Quantitative Metallography
- By Luke Wentlent and Thaer Alghoul and Mohammed Genanu
SnAgCu Elevated Temperature Aging Study
-By Peter McClure
REL11B. HiP Assembly Challenges with Window PCB
- By Michael Meilunas
MAT6C. Sintered Ag Die Attach Materials
- By Pericles Kondos
June Meeting
- By Jim Wilcox
APD3B. Large Body BGA Characterization
- By Michael Meilunas
REL15C. Combined Power Cycle & Environmental Thermal Cycle
- By Michael Gaynes
REL7A. SnAgCu Thermal Aging Effects
- By Peter McClure
MAT6C. Sintered Silver Die Attach Materials
- By Pericle Kondos
MAT4B. Reliability of TIM2 Materials
- By Michael Gaynes
REL9A. Mixed VIPPO Solder Defect Investigation
- By Pericles Kondos
REL12A. Thermal Cycle Test of 2.5D Copper Pillar Interconnects
- By Mohammed Genanu
Bismuth Based Transient Liquid Phase Bonding
- By Junghyun Cho
MAT7E. Alternate Pb-free Solder Alloy Reliability
- By Francis Mutuku
MAT6G. Solder Alloys for Automotive Applications
- By Luke Wentlent
APD2B. Joining for Flexible Hybrid Electronics
- By Peter McClure
Low Temperature Mixed Solder Assembly
- By Peter Borgesen
APD11B. Laser Reflow Assembly -- First Looks
- By Luke Wentlent
March Meeting
- By Jim Wilcox
REL12A. 2.5D Copper Pillar Interconnect Structures
- By Mohammed Genanu
APD11A. Laser Reflow Flip Chip Characterization
- By Jim Wilcox
MAT2A. Four Point Bend Pad Cratering Study
- By Michael Meilunas
REL3E. Laminate Material Effects in Mechanical Reliability Testing
- By Michael Meilunas
REL10B. Solder Alloy Mechanical Reliability Testing
- By Michael Meilunas
Reliability Impact of Long Term Thermal Aging on Lead Free Solders
- By Sa'd Hamasha
MAT4B. TIM2 Performance Evaluations TIM2 Characterization Review
- By Michael Gaynes
MAT4C. Ganged Heatsink TIM2 Reliability
- By Michael Gaynes
MAT9B. Flexible Hybrid Electronics: Materials and Assembly
- By Nancy Stoffel
MAT1B. Reworkable Component Underfills
- By Pericles Kondos
MAT7E. Solder Alloy Reliability Studies
- By Francis Mutuku
MAT6C. Sintered Silver Die Attach Materials
- By Pericles Kondos
REL15B,C. Power Cycle Reliability Testing
- By Michael Gaynes
REL2A. Deformation Behavior of SnAgCu Solder in Variable Amplitude Cycling
- By Luke Wentlent
REL17B. SiP Structures - Alternate Solder Alloy Interconnects
- By Michael Meilunas
REL9A. Mixed VIPPO Array BGA Soldering Defects
- By Matt Kelly
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