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March, 2009 Presentations
Fatigue of low-Ag solder joints
Thermal cycling of lead free solders
Empirical modeling of thermal cycling test results
Lead free solder microstructure
Results and models for the effects of varying loads on lead free fatigue (Miner's rule)
Tutorial on the mechanisms and complications of solder pad cratering
A serious risk of pad cratering is universally overlooked
Cratering and solder failure for different SAC alloys in drop and cyclic impact (pendulum) testing
Printing of solder paste for 0.4mm pitch area array assembly manufacturing
Intermetallic bonds to ENEPIG and Ni/Au pad finishes
Performance of underfills and edge bonds in drop testing
Characterization of Thermal Interfaces
Precommercial TIM Process Development and Reliability Evaluation
June, 2009 Presentations
Reliability Investigation of SN100C: Phase II
Lead Free Thermal Cycling Progress
Recrystallization of SAC Solder Joints in Thermal Cycling
Accelerated Aging of Lead-Free SolderJoints
Effects of Different Load Combinations on Pb-Free Solder JointsSn
Lead Free Solder Joint Reliability
Sporadic Failure of Solder Joints on Ni/Au Pads
Rapid Ranking and Screening Procedures for Underfills and Corner/Edge Bonds
October, 2009 Presentations
Neural Network Analysis of Thermal Cycling Data
New Thermal Interface Materials
Reliability of Thermal Interface Materials
Spalling in Lead Free Solder Joints
Microstructure of Low-Ag Alloys
Damage Accumulation Under Variable Loads
Damage Accumulation and Microstructure
Microstructure Evolution in SnAgCu Solder Joints
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