Embedded Files
October Meeting
Welcome by Jim Wilcox
REL20B. Thermal Stability of Electrolytic Capacitors
by Michael Meilunas
REL20A. Multilayer Ceramic Capacitor Cracking Evaluation
by Michael Meilunas
MAT2D. Pad Cratering Resistance of Cap Layer Laminates
by Michael Meilunas
MAT1C. Component Edge Bonding: Process and Reliability
by Pericles Kondos
MAT7H. Low Temperature Solder Reliability: ATC Performance
by Michael Meilunas
APD11A. BGA Pad Repair using Aerosol Jet Printing
by Dylan Richmond
REL2B. Drop Shock Modeling: Effect of Solder Joint Geometry
by Jim Wilcox, Mohammad Gharabeih, Luke Wentlent
REL10C. Drop Shock Behavior of Hybrid Low Temperature Solder Joints
by Jim Wilcox, Michael Meilunas,
Qorvo -- SHIP-RF Overview (Heterogeneous Integration Packaging prototype facility)
by Ted Jones
REL8B. Underfilled WLCSP Reliability (No-Clean Assembly)
by Michael Meilunas
MAT3A. "Ni-less ENIG Premium" Surface Finish Evaluation
by Pericles Kondos
REL11C. Crystallographic Investigation of Hybrid LTS Ball Drift
by Christopher Gourlay, Jingwei Xian
REL18B. Current Stressing in Near Eutectic BiSn Low Temperature Solder Alloys
by Eric Cotts, Faramarz Hadian, Javier Flores, Sitaram Panta
MAT6C. Heraeus DA320 Silver Sinter Paste
by Pericles Kondos
MAT4D. Liquid Metal Thermal Interface Stability
by Peter McClure
MAT4E. Thermal Interface Material Testing Apparatus
by Peter McClure
March Meeting
Welcome/Introduction
by Jim Wilcox
MAT2D. Laminate Pad Cratering Analysis using Monotonic Bend Test
by Michael Meilunas
REL10C. Solder Alloy Drop Shock Performance
by Luke Wentlent, Tian Sang
MAT3B. Reliability of Electrolytic Pd, Autocatalytic Au (EPAG) Surface Finish
by Michael Meilunas
MAT7H. Low Temperature Solder Reliability: 0/100C ATC Performance and ATC Profile Effects
by Luke Wentlent, Michael Meilunas
MAT4B. Graphite Thermal Pad Reliability Testing
by Peter McClure, Dylan Richmond
REL17A. Interval Testing TIMs in ATC -- Experimental Design and Debug
by Peter McClure
Dyconex -- Reliability and Biostability of Bio-Electronic Implants
by Eckardt Bihler
MAT4D. Liquid Metal Thermal Interface Material Processing
by Pericles Kondos
Saab -- Solderability and Wetting of Immersion Tin Finish
by Jan Gilldorf
Electromigration in Homogeneous Near Eutectic BiSn Solder Joints
by Faramarz Hadian, Eric Cotts
MAT7A. Thermal Cycle Dwell Time Effects in High Reliability Solders
by Luke Wentlent
MAT1C. Component Edge Bonding: Process and Reliability
by Pericles Kondos, Xinyu Zhang
MAT1C. Component Edge Bonding: Rework Process Trials
by Pericles Kondos, Xinyu Zhang
REL9A. PCB Thermal Response of Mixed VIPPO BGA Array
by Pericles Kondos
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