Embedded Files
October Meeting
by Jim Wilcox
MAT1C. BGA Capillary Underfill & Edge Bond Evaluation
by Pericles Kondos
MAT6H. Copper Sintering Studies
by Yujia Wang, Peter McClure
MAT8E. Conformal Coating Evaluations using Silver Thin Films
by PJ Singh
MAT4C. Board Level Thermal Interface Materials: Performance and Reliability
by Peter McClure
MAT4D. Metal Die Level Thermal Interface Innovations
by Tim Jensen
MAT4D. Indium TIM1 Characterization
by Peter McClure
MAT7F. Low Melt Solder Mixed Assembly Mechanical Reliability
by Luke Wentlent
MAT7F. Low Melt Solder Drop Shock Performance
by Xuanyi Ding, Luke Wentlent
REL17A. Reflow and Current Stress Effects on SnBi Solder Joint Reliability
by Eric Cotts, Faramarz Hadian
REL17B. SnBi Solder Reliability: High Current Thermal Cycle Test
by Luke Wentlent
MAT9B. Low Melt Solder Mixed Assembly: Thermal Cycle Reliability
by Luke Wentlent
MAT3B. EPAG Surface Finish Evaluation
by Michael Meilunas
MAT7A. High Reliability Solder Alloy Studies
by Luke Wentlent
REL9A. Mixed VIPPO BGA Array Solder Defects
by Pericles Kondos
APD3C. Copper Coin Board Assembly
by Peter McClure
REL8A. Low CTE Circuit Boards for Large Body WLCSP
by Michael Meilunas
REL3E. Alternate Solder Alloy Vibration Testing
by Michael Meilunas
3D Printed Die Level Heatsinks by Selective Laser Melting
by Arad Azizi, Scott Schiffries
March Meeting
by Jim Wilcox
MAT6H. Sintered Copper Joining
by Peter McClure
MAT7F. Low-Melt BiSn Mixed Assembly: Effect of Reflow Temperature
by Eric Cotts
MAT7F. Low-Melt BiSn Mixed Assembly: Mechanical and Microstructural Behavior
by Luke Wentlent
REL9A. Mixed VIPPO BGA Array Soldering Defects
by Pericles Kondos and Thaer Alghoul
REL18A. BiSn Mixed Solder Electromigration
by Faramarz Hadian, Mohammed Genanu, Eric Cotts
Power Packaging Assembly Challenges
by Douglas Hopkins
MAT1C. Capillary Underfill and Edge Bonding of BGA Components
by Pericles Kondos and Thaer Alghoul
MAT6G. High Reliability Solder Alloys: Effect of Bi Content
by Luke Wentlent
MAT4C. Thermal Interface Materials: Thermal Mechanical Cycling
by Michael Gaynes and Peter McClure
MAT9B. Self Assembly Paste Evaluation SAP Overall - 8X video
by Peter McClure and Yujia Wang
REL11B. Modeling of BGA Applications under Tensile Load
by Michael Meilunas and Mahdi Farahikia
REL15C. Power Cycle Reliability Testing (PBGA, QFN)
by Michael Gaynes, et al
APD8A. Solder Voiding Behavior in Vacuum Reflow Soldering Vacuum Reflow video
by Michael Meilunas
MAT6C. Sintered Silver Printing and Die Attach Study
by Thaer Alghoul and Pericles Kondos
MAT4B. Thermal Interface Resistance: Surface Roughness Effects
by Peter McClure and Michael Gaynes
APD11C. Selected Area Laser Rework
by Luke Wentlent
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