Embedded Files
October Meeting
by Jim Wilcox
DSC Examination of BiSn Low Melt Solder with SnAgCu
by Peter McClure
Durafuse™ LT Solder Assembly: Early Observations
by Alyssa Yaeger
Creep Strength of High Reliability Solders in Thermal Cycle
by Mohamed Belhadi
Direct Observation of Thermal Interface Performance
by Peter McClure
Thermal Interface Material (TIM2) Reliability Test Update
by Peter McClure
BiSn Solder under Current Stress: Bi Accumulation and Variability
by Eric Cotts
Low Temperature Solder ATC with Current Stress
by Alyssa Yaeger
BiSn Solder Drop Shock Degradation with Current Stress
by Michael Meilunas
by Peter Borgesen
Crystallographic Investigation of Hybrid LTS Solder Ball Drift
by Jingwei Xian and Chrisopher Gourlay
Intel Heterogeneous Integration Prototype (SHIP) Facility
by Saikumar Jayaraman and John Sotir
Thermal Cycle Fatigue Acceleration with SnBi Solder Joints
by Faramarz Hadian
ATC Reliability Testing Update
by Michael Meilunas
March Meeting
by Jim Wilcox
LCP Flex Bonding: Design/Process Considerations
by Dylan Richmond, Peter McClure
Comparing Semi-Sintering Silver Pastes on Gold Surfaces
by Pericles Kondos
Heraeus DA320 Silver Sinter Paste: An Update
by Pericles Kondos
Solder Joint Gold Embrittlement Observations
by Alyssa Yaeger
Conformal Coating Sulfur Corrosion Failure Rates and Mechanisms
by Marie Cole, Eric Campbell
New Variables in Low Temperature Solder (LTS) Drop Performance
by Jeremy Gendler
Low Temperature Solder (LTS) Mechanical Behavior
by Alyssa Yaeger
LTS ATC Failure & Reliability Observations: Hybrid and Homogeneous Joints
by Michael Meilunas
Enhancing Moore’s Law’s Next Frontier through Heterogeneous Integration
by Deepak Kulkarni
Solder Joint Electromigration during Constant Current and Temperature Stress
by Javier Flores
Quality Testing of TIM1s in Packages with Laser Heating: Initial Proof of Concept Study
by Peter McClure
Adding Conductivity Measurements to ATC TIM Test Boards: IR Measurement of Heating
by Peter McClure
SAFI-Tech Liquital® Supercooled Liquid Solder Spheres: A First Look
by Pericles Kondos
Further Evaluation of Ni-less ENIG Premium Surface Finish
by Pericles Kondos
Pad Repair with Aerosol Jet Print of Copper Ink: Update
by Peter McClure
Page updated
Google Sites
Report abuse