Embedded Files
October Meeting
MAT7H. SnBi(Ag) Low Melting Temperature Solder
- By Francis Mutuku
MAT6F. Alternative Alloy Drop Shock Testing
- By Jim Wilcox
REL3D. Elevated Temperature Harmonic Vibration
- By Xin Huang
- By In-Tae Bae
Next Generation Biometric Security Access System
- By Don Lee (Samsung)
APD1D. Solder Process Voiding Study
- By Michael Meilunas
QFN Thermal Modeling QFN Thermal Calculator
- By Matt Schwiebert
REL15A. Power Cycle Reliability Testing
- By Michael Gaynes
REL12A. Copper Pillar Interconnects
- By Mohammed Genanu
area Laser Selective Reflow (aLSR)
- By J.J. Choi
APD11A. aLSR Flipchip Assembly
- By Jim Wilcox
Flexible Hybrid Electronics / Thin Die Assembly
- By Eric Forsythe (Army Research Lab)
REL16A. Die Size Effects on Thermal Fatigue Reliability
- By Richard Coyle and Jim Wilcox
MAT7E. Alternative Solder Alloy ATC Reliability
- By Francis Mutuku
MAT1B. Component Underfills: Process & Performance
- By Pericles Kondos
MAT4B. Thermal Characterization of TIM Putties
- By Michael Gaynes
APD1C. Fine Pitch Paste Printing (50um & 80um Stencils)
- By Michael Meilunas
June Meeting
- By Jim Wilcox
MAT6C. Sintered Silver Die Attach: Materials & Process
- By Pericles Kondos and Falguni Sood
MAT7x. Alternative Solder Alloy Reliability Studies
- By Francis Mutuku
MAT6D. High Temperature Passive Device Surface Finish
- By Faramarz Hadian
REL3C. Elevated Temperature Vibration Testing
- By Quang Su and Xin Huang
- By Mike Meilunas
MAT4B. Thermal Interface Materials Characterization
- By Mike Gaynes
MAT1B. Reworkable Component Underfills
- By Pericles Kondos
REL6A. Reliability Consequences of Paste Print Variability
- By Mike Meilunas
Solder Paste Printing Performance
- By Denis Barbini
Adaptive Paste Printing Process
- By Hakan Ugur
APD1A. Broadband Solder Paste Printing
- By Mike Meilunas
March Meeting
- By Jim Wilcox
MAT8B. Conformal Coating: New Materials & Methods
- By Mike Meilunas
MAT8B. Conformal Coating for Resistor Corrosion Protection
- By Marie Cole
REL15A. Power Cycle Reliability Test On Demand
- By Mary Hatfalvi
MAT7G. Effect of Alloy Composition on Isothermal Solder Joint Shear Fatigue
- By Francis Mutuku
MAT7E. Thermal Fatigue Performance of Third Generation Pb-free Solder Alloys
- By Babak Arfaei
REL16A. Die Size Effects on BGA Package Interconnect Reliability
- By Richard Coyle
REL12A. Fine Pitch Copper Pillar Interconnect
- By Mohammed Genanu
MAT1B. Reworkable Component Underfills
- By Pericles Kondos and Andrew Feigel
MAT9A. Conductive Filled Elastomer Connections
- By Mike Meilunas
MAT6D. Component Terminations for Elevated Temperature Operation
- By Faramarz Hadian
Exploring Bismuth as a New Pb-free Alternative for High Temperature Electronics
- By Jungyhun Cho
REL6A. Solder Paste Printing Correlations to Reliability:
BGA Components - By Mike Meilunas
Bottom Terminated (QFN) Components - By Sai Sriperumbudur
APD1A. Broadband Solder Paste Printing
- By Mike Meilunas
Quantitative Image Analysis Methods for SAC305 Microstructures
- By Larry Lehman
MAT6C. Sintered Silver Die Attach Processing
- By Pericles Kondos
Sintered Silver Creep Deformation
- By Peter Borgesen
Page updated
Google Sites
Report abuse