Embedded Files
November Meeting
Wednesday Morning
- By Jim wilcox
MAT1A – Underfill Studies:
a) Reliability Update and Failure Analysis
b) Underfilm instead of Underfill
- By Pericles Kondos
MAT6B – Characterization of Ag-sintered Past as Pb-free Die Attach Material as
- By Harry Schoeller
MAT7B – Isothermal Shear Fatigue Behavior of Microalloyed Lead-Free Solder Alloys
- By Francis Mutuku
MAT7D –Drop Shock Reliability of Various Lead-Free Alloys
- By Babak Arfaei
Pb-free Manhattan Project - Rebaseline -
- By Linda Woody
Wednesday Afternoon
MAT8A – Impact of Conformal Coatings on Thermal Cycle Reliability of SMT Components
- By Michael Meilunas
MAT7A – Effect of PCB Surface Finish and Solder Volume on Thermal Fatigue Performance of
Lead-Free and SnPb Solder Joints On Demand
- By Babak Arfaei
MAT6C – Thermo-mechanical Reliability of High Temperature Interconnects
- By Harry Schoeller
REL3A – Finite Element Analysis and Experimental Characterization for
Vibration Reliability of LGA vs. BGA Packages
- By Quang Su and Aaron Stewart
- By Dave Pinsky,Tony Rafanelli,
Dave Hillman, Sebastian Fonseka,
Steve Davidson
Thursday Afternoon
REL2A – Model for Fatigue Life of Lead-free Solder
- By Peter Borgesen
REL2A – Effects of Varying Amplitude on Solder Joint Fatigue in Isothermal Cycling
- By Sa’d Hamasha
REL11A – Effect of TIM Compression Loads on BGA Reliability
- By Nicholas Graziano
MAT6B – Isothermal Fatigue of High Melting Point Alloys
- By Harry Schoeller
MAT2B – Effect of Pad Locations relative to Glass Weave on Cratering
- By Mohammad Quran
MAT6A – Effect of Sn Component Surface Finish on 92.5PbSn2.5Ag
- By Harry Schoeller
MAT6B –2015 Research Plan Highlights
- By Jim Wilcox
June Meeting
- By Martin Anselm
Materials Track
MAT1A – Underfill Part I - On Demand
- By Pericles Kondos
MAT1A – Underfills and Adhesives-Part II - On Demand
- By Mohammad Quaran
MAT4A – Characterization of Gap Pads with Fixed Bondline and Phase Change Materials - On Demand
- By Harry Schoeller
REL11A – Effect of Compression Loads on BGA Reliability - On Demand
- By Nicholas Graziano
MAT8A – Conformal Coating Update - On Demand
- By Martin Anselm
MAT2A – Pad Cratering in TB2014-ELM - On Demand
- By Pericles Kondos
MAT6C – Characterization of High Temperature Solder Alloys - On Demand
- By Harry Schoeller
MAT7B – Effect of Microstructure on Isothermal Mechanical Properties of Various Solder Alloys - On Demand
- By Francis Mutuku
MAT7C – Effect of Isothermal Aging on Reliability of LF Product - On Demand
- By Babak Arfaei
- By Richard Coyl (Alcatel-Lucent) ref: p765 Coyle et al. 64th ECTC
Advanced Process Development (APD) Track
SigNature® DNA – DNA-based Anti-counterfeiting Technology Solution
- By Janice Meraglia (VP for Military and Government Programs at Applied DNA Sciences)
MAT6B – Characterization of High Temperature Solders used for Passive Devices - On Demand
- By Harry Schoeller
MAT5A – Paste Print Project Status Update
- By Chris Anglin
Reliability Track
REL2A – Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints
- By Peter Borgesen
REL6A – Print Correlations to Reliability- On Demand
- By Michael Meilunas
REL3A – LGA vs. BGA Vibration Performance
- By Aaron Stewart
REL10A – Drop test JESD22-B111 Redesign Evaluation Characterization of Proposed JEDEC Drop Test Vehicle
- By Michael Meilunas
MAT7A – Effect of Nanodopants on Reliability of LF Solders in Drop Testing - On Demand
- By Babak Arfaei
February Meeting
February AREA Introduction - On Demand
- By Martin Anselm
Reliability Track
MAT4A: Component Level TIM Characterization (Final Report) - On Demand
- By Harry Schoeller
REL2A: Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints - On Demand
- By Sa'D Hamasha
REL2A: Effects of Sn-grain Orientation on the Fatigue Life of Lead-free Solder Joints - On Demand
- By Sa'd Hamash and Luke Wentlent
REL10A: Drop Test JESD22-B111 Redesign Evaluation
- By Michael Meilunas
REL4A: Creep Corrosion - On Demand
- By Pericles Kondos
- By Michael Meilunas
REL3A: Circuit Board Strain Laser Vibrometer
- By Prof. Quang Su (Binghamton University)
REL3B: Vibration Reliability Plans
- By Prof. Quang Su (Binghamton University)
- Prof. Su's Combined Presentations On Demand
Design and Reliability - On Demand
1 Inch Metal Ball Drop on Glass - Video
300mm Wafer Warpage during Reflow - Video
Cell Phone Case with PCB - Video
Component Warpage at Elevated Temperature - Video
- By Prof. SB Park
Modeling and Characterization for Shock and Vibration - On Demand
- By Prof. James Pitarresi (Binghamton University)
Advanced Process Development (APD) Track
APD3B: WLCSP Reliability Analysis Effect of RDL Design on Thermal Cycle Results
- By Michael Meilunas
APD8A: BGA vs. LGA Drop Test Comparison - On Demand
- By Gaurang Joshi
- By Michael Meilunas
SPI Optimization - Koh Young - On Demand
- By JD Shin of Koh Young
BVA Review - Invensas - On Demand
- By Charles Woychik of Invensas
Materials Track
MAT8A: Conformal Coating Effect on ATC Reliability - On Demand
- By Martin Anselm
MAT3A: TB2013 Surface Finish Failure Analysis - On Demand
- By Babak Arfaei
MAT7A: New Alloy Project - On Demand
- By Babak Arfaei
MAT7A: New Lead Free Alloy Evaluation and Microstructure - On Demand
- By Francis Mutuku
MAT1A: Underfill Update - On Demand
- By Pericles Kondos
MAT6B: Fatigue Behavior of New Die Attach Alloys
- By Harry Schoeller
MAT6A: Update Effect of Sn on HMP Solder - On Demand
- By Harry Schoeller
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