Embedded Files
October Meeting
by Jim Wilcox
MAT4C - Thermal Cycle Testing of Thermal Grease Materials
by Peter McClure
MAT4B - Electrical Resistance Monitoring of Graphite Thermal Pads in ATC
by Peter McClure, Dylan Richmond
MAT4D - Gallium-Indium Liquid Metal Thermal Interface Studies
by Peter McClure, Andra Chen
MAT6C - Semi-Sintering Silver Paste
by Pericles Kondos, Xinyu Zhang
Screen Printed Ink Circuitry - Optimizing Resolution
by Peter McClure, David Shaddock
MAT1C - Component Edge Bonding: Process and Reliability
by Pericles Kondos, Xinyu Zhang
REL17A - Effect of Current Stress on near Eutectic SnBi Solder Joints
by Faramarz Hadian, Eric Cotts
HP Labs - 3D Printed Electronics with Multi Jet Fusion
by Kris Erickson
MAT7F - Low Temperature Solder Joint Mechanical Behavior
by Luke Wentlent
MAT7H - Thermal Cycle Reliability of BiSn Solder Interconnects
by Michael Meilunas
REL17B - Low Temperature Solder Reliability Failure Mechanisms
by Luke Wenlent
MAT7A - High Performance Solder Alloys: Dwell Time Studies
by Jim Wilcox, Luke Wentlent
REL10B - High Performance Solder Alloys: Drop Shock
by Tian Zhang, Luke Wentlent
REL3E - High Performance Solder Alloys: Vibration
by Arvind Srinivasan, Michael Meilunas, Sa'd Hamasha
REL15B - Power Cycle Reliability Testing (QFN, BGA)
by Michael Gaynes, Michael Meilunas
March Meeting
by Jim Wilcox
MAT7F. Microstructure Observations in As-Reflowed SnBi Mixed Solder Joints
by Luke Wentlent
REL17A. Effects of Current Stress on the Microstructure of SnBiAg-SAC Mixed Solder Joints
by Faramarz Hadian, et al.
MAT7I. Low Temperature Solder Thermal Cycle Reliability Testing and Failure Mechanisms
by Michael Meilunas and Luke Wentlent
MAT7F. Mechanical Behavior of Low Melt Mixed Assembly Joints
by Luke Wentlent
REL8A. ATC Reliability of Large Body WLCSP and SMT Devices on Low CTE PCB
by Michael Meilunas
MAT3B. PCB Surface Finishes: EPAG, ENIG, & Cu/OSP
by Michael Meilunas
REL18A. Failure Detection in Underfilled Components
by Michael Meilunas
MAT1C. Component Underfill and Edge Bonding Project Update
by Pericles Kondos
MAT4C. Thermal Cycle Testing of Thermal Grease and Phase Change Materials
by Peter McClure
MAT4E. Liquid Ga-In Die Level Thermal Interface Material -- Initial Studies
by Peter McClure
APD3C. Copper Coin PCBs -- Preliminary Reliability Evaluation
by Peter McClure
REL2B. High Performance Solder Alloy Studies: Thermal Shock and Dwell Time Effects
by Luke Wentlent
Thermal Fatigue of High Performance Pb-Free Solder Alloys (iNEMI)
by Richard Coyle
APD11B. Selected Area Laser Reflow of Temperature Sensitive Components
by Luke Wentlent
REL9A. Mixed VIPPO BGA Array Solder Defects
by Pericles Kondos and Tian Sang
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