Embedded Files
October Meeting
Welcome/Introduction
by Jim Wilcox
Solder Thermal Interface Material (sTIM): Processing and Reliability Analysis
by Ali Davoodabadi
Laser Probe Techniques for Bulk and Interface Thermal Conductivity Measurement
by Sara Makarem
Thermal Imaging for Direct Observation of TIM Stability under Power Cycling
by Ali Davoodabadi
Liquid-Metal-Filled Polymer Performance and Stability: TIM1.5 vs. TIM1
by Ali Davoodabadi
Ni-Less ENIG Premium Surface Finish Evaluation
by Alyssa Yaeger and Joseph Brown
Further Durafuse-LT Evaluation
by Alyssa Yaeger
Solder Performance and Reliability Assurance Project: A Pathway to Defense Modernization
by Carol Handwerker
Understanding Component Behavior and Its Effect on Solder Alloy Reliability in Thermal Cycling
by Michael Meilunas
Automotive Alloy Thermal Cycle Reliability
by Alyssa Yaeger
Low Temperature Solder (LTS) Current Stressing and Drop Testing
by Michael Meilunas
Solder Joint Height Effect on Drop Testing Performance - SAC305
by Sufyan Tahat
Vibration Testing of LTS B37 Solder Alloy
by Nithin Lakshminarayan
Effect of Current Stress on SnBi Thermal Cycle Reliability
by Alyssa Yaeger
Optimizing Reliability of Solder Joints Reflowed at Temperatures Below 140C
by Sai Kiran Reddy Munnangi
April Meeting
by Jim Wilcox
Introduction to the New Universal Instruments
by Glenn Farris
Novel Anisotropic Interconnect for Solder, ACA and ACF Replacement (ZTACH® ACE)
by Manian Ramkumar and Madhu Stemmermann
SnBi Thermal Cycle Reliability During Current Stress
by Alyssa Yaeger
Drop Test Performance of Low Melt Solder BGAs
by Michael Meilunas
by Peter Borgesen
Package Development of SiC Power Electronics Modules for EV Applications
by Boyi Zhang, Yu-Hsuan Tsai, Peter Barbosa
Evaluation of Transient Liquid Phase Sintering (TLPS) Paste
by Alyssa Yaeger
Liquid Metal Composite TIM Performance and Stability Analysis
by Ali Davoodabadi
by Peter Hopkins
Thermal Imaging for Direct Observation of TIM Stability under Power Cycling
by Ali Davoodabadi
Evaluating the Reliability of Solder Thermal Interface Material (STIM)
by Ali Davoodabadi
Thermal Shock vs. Thermal Cycle of Alternate "High Reliability” Alloys
by Michael Meilunas
Real-time X-ray Video Imaging of Ph-Free Solder Pastes under Simulated SMT Reflow
by Norman Armendariz
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