2018 Meetings
October Meeting
- by Jim Wilcox
- by Michael Gaynes
APD2B. Flexible Substrate Chip Joining
- by Peter McClure, Mukund Ayalasomayajula
MAT8D. Conformal Coating for Mitigation of Sulfur Induced Resistor Corrosion
- by Marie Cole, et al.
MAT7F. Low-Melt BiSn Mixed Solder Assembly
- by Luke Wentlent
REL18A. Electromigration Behavior of BiSn Mixed Solder Joints
- by Faramarz Hadian
Packaging Challenges for SiC Power Semiconductors
- by Arun Gowda
APD8A. In-line Vacuum Reflow SMT Process
- by Michael Meilunas, Arvind Karthikeyan
APD11B. Laser Reflow Die Stacking
- by Luke Wentlent
REL9A. Mixed VIPPO Array Solder Joint Defects
- by Pericles Kondos
REL5B. Screening the PCB Microvia Reliability Problem
- by Kevin Knadle
MAT6C. Sintered Silver Die Attach Materials Update
- by Pericles Kondos
MAT4B,C. Thermal Interface Materials (TIM2): Performance & Reliability
- by Michael Gaynes, Mukund Ayalasomayajula
MAT6G. Pb-free Solder Alloys for Engine Control Applications
- by Michael Meilunas
MAT9B. Self Assembly Paste Evaluation SAP consolidation video - 8X (pg. 7)
- by Peter McClure
Effect of Precipitate Coarsening on Solder Joint Life in Test and Use
- by Thaer Alghoul, Peter Borgesen
APD2B. Ultra-thin Wafer Die Ejection from Tape
- by Peter McClure, Preeth Sivakumar
May Meeting
(San Jose, CA)
- by Jim Wilcox
Sintered Silver Bonding Studies
- by Pericles Kondos (presented by J. Wilcox)
Pb-free Solder Alloy Evaluations
- by Luke Wentlent
Thermal Interface Materials: Performance & Reliability
- by Michael Gaynes (presented by J. Wilcox)
System in Package (SiP) Interconnect Reliability
- by Michael Meilunas (presented by J. Wilcox
Area Selective Laser Reflow Assembly
- by Luke Wentlent
Flexible Electronics Substrate Assembly
- by Peter McClure (presented by L. Wentlent)
Mixed VIPPO Array Soldering Defects
- by Pericles Kondos (presented by J. Wilcox)
March Meeting
- by Jim Wilcox
APD2B. Flexible Substrate Chip Joining
- by Peter McClure
APD2C. SnAgCu Soldering to Conductive Ink Circuitry
- by Peter McClure
MAT6G. Solder Alloys for Engine Control Applications
- by Luke Wentlent
PCB Hole Fill Process Capability Study
- by Anjani Ladhar
REL9A. Mixed VIPPO Array BGA Soldering Defects
- by Pericles Kondos
MAT7F. Low Temperature Mixed Solder Assembly: Mechanical Characterization
- by Peter Borgesen
MAT7F. Low Temperature Mixed Solder Assembly: High Strain Rate Fragility
- by Luke Wentlent
MAT4D. High Performance Die Level Thermal Interface Materials
- by Divya Choudhary
REL17A. System in Package Interconnect Reliability - SAC305
- by Michael Meilunas
AREA Research Portfolio Briefs - March 2018
- by Michael Meilunas, Pericles Kondos, Michael Gaynes
IPC Assembly Specification Updates
- by Brook Sandy-Smith
Conformal Coating for Sn Whisker Mitigation
- by Fei Dong
MAT8B. Conformal Coating Thermal Cycle Reliability Impact
- by Michael Meilunas
MAT8D. Conformal Coating for Mitigation of S Induced Resistor Corrosion
- by Marie Cole
REL15C. Power Cycle Reliability Testing
- by Michael Gaynes
APD11B. Laser Selective Reflow Assembly and Reliability
- by Luke Wentlent
APD11C. Laser Rework Station Development
- by Brian Sohn