Embedded Files
September Meeting
Martin Anselm – Introduction
David McCann Vice President, Packaging and R&D, GLOBALFOUNDRIES – Keynote
Trends in the Development and Implementation of Interconnect and Packaging Technologies
MATERIALS TRACK
Harry Schoeller – MAT4A: TIM, The Effect of Thermal Storage on Gap-Pad Performance (On Demand)
Pericles Kondos – MAT1A: Underfill Studies - Process Development and Characterization (On Demand)
Yuan Zeng – MAT10A: Laminate and Glass Studies in Pad Cratering (On Demand)
Babak Arfaei – MAT7A: New Alloy Reliability Testing - Effect of Size and Composition (On Demand)
Francis Mutuku – MAT7A:
Effect of Solder Composition and Trace Elements on Mechanical Shear Fatigue (On Demand)
RELIABILITY TRACK
Sa’D Hamasha – REL2A:
Accounting for the Evolution of SnPb and SnAgCu Properties and the Resulting Breakdown of Linear Damage Accumulation Rules in Cycling with Varying Amplitudes (On Demand)
Prof. Peter Borgesen (Binghamton University) – REL2A:
Current LF Models and Progress Update on Modification (On Demand)
Pericles Kondos – REL4A: Creep Corrosion - Effects of Test Methods (On Demand)
Gaurang Joshi – REL1A: PCB Prestress & Pad Cratering a Modified Test Method (On Demand)
Prof. Quang Su (Binghamton University) – REL3A:
Vibration Reliability Testing and Analysis
Prof. James Pitarresi (Binghamton University) – REL3A:
REL3A: Modeling and Characterization of Shock and Vibration (On Demand)
Babak Arfaei – MAT2B:
Effect of Isothermal Preaging on Accelerated Thermal Cycling Tests (On Demand)
ADVANCED PROCESS DEVELOPMENT TRACK
Yuan Zeng – APD3A: LGA vs BGA Pad Cratering (On Demand)
Michael Meilunas – APD2A: 0.3mm Pitch Build Report and Drop Testing and ATC Results (On Demand)
Michael Meilunas – APD3A: TB2013 Reliability Update (On Demand)
Babak Arfaei – APD3A: TB2013 Reliability Failure Mode Evaluation (On Demand)
Martin Anselm – MAT8A: Conformal Coating Early Reliability Data and Characterization (On Demand)
Harry Schoeller – MAT6A:
High Melting Point (HMP) Electronics - Test Board Design and Planning (On Demand)
During our September meeting we had the opportunity to thank our Members that have been with our organization for more than 10 years with a Partnership Award. Below are the images of the event and our recipients with our founder George Westby.
Rockwell Colins, David Adams
Rockwell Automation
Ashok Wadhwa and Bob Veale
IBM
Isabel de Sousa, Prabjit Singh, Mitch Ferrill &Jim Wilcox
Alcatel-Lucent
Richard Coyle & Holly Rubin
Ericsson, Lars Bruno
Plexus, Ursula Marquez de Tino
Celestica, Jeff Kennedy
Motorola Solutions
Henry Grossfeld, Brent Gingrich, Thomas Zanatta, (GW) and Eduardo Freire
Lockheed Martin
Dan Blass
June Meeting Presentations
Business Cards of our members and guests in attendance.
Introduction by Martin Anselm
Materials Track
MAT4A - Component Level TIM Comparison by Harry Schoeller
MAT4A - Componentent Level TIM Comparison - On Demand
MAT1A - Underfill Research Plans by Pericles Kondos
MAT1A - Underfill Research Plans - On Demand
MAT10A - Pad Cratering Glass Orientation Effect by Yuan Zeng
MAT10A - Pad Cratering Glass Orientation Effect - On Demand
MAT3A - TB2013 Pad Finish Evaluation by Pericles Kondos
MAT3A - TB2013 Pad Finish Evaluation - On Demand
MAT6B - New Pb-free Die Attach Alloys by Harry Schoeller
MAT6B Harry - New Pb-free Die Attach Alloys - On Demand
MAT2B & MAT7A - Low Ag LF Microstructure and Reliability by Babak Arfaei
MAT2B & MAT7A - Low Ag LF Microstructure and Reliability - On Demand
MAT7A - Effect of Microstructure on Shear Fatigue by Francis Mutuku
MAT7A - Effect of Microstructure on Shear Fatigue - On Demand
X-ray Tomography, Presented by NSI GUEST SPEAKER, Wes Wren
Advanced Process Development Track
ADP3A - TB2013 Build Report and Printing Optimization by Michael Meilunas
ADP3A - TB2013 Build Report and Printing Optimization - On Demand
ADP4A - Vapor Phase Rework of High IO Components by Harry Schoeller
ADP4A - Vapor Phase Rework of High IO Components - On Demand
MAT5A - 0.3mm Pitch Update by Jeff Schake of DEK
MAT5A - 0.3mm Pitch Update - On Demand
Challenges in Rework for Smart Phones and Tablets, Presented by OKi GUEST SPEAKER, Paul Wood
Reliability Track
MAT8A - Impact of Conformal Coating on Thermal Cycling Reliability of SMT Components by Martin Anselm
MAT8A - Impact of Conformal Coating on Thermal Cycling Reliability of SMT Components - On Demand
REL1A - Modeling of Spherical Bend Test Method by Prof. Jame Pitarresi of BU
REL1A - Effect of Prestressing on PCB Pad Cratering by Michael Meilunas
REL1A - Effect of Prestressing on PCB Pad Cratering - On Demand
REL4A - Creep Corrosion Update - TB2013 Surface Finish Testing by Pericles Kondos
REL4A - Creep Corrosion Update - TB2013 Surface Finish Testing - On Demand
REL2A - Variable Loading of Low Ag Alloys by Sa'D Hamasha
REL2A - Variable Loading of Low Ag Alloys - On Demand
REL2A - Thermal Cycling, The Mechanisms Behind Surprising Trends by Sam Sirazi
REL2A - Thermal Cycling, The Mechanisms Behind Surprising Trends - On Demand
REL3A - Vibration Test Update and FA by Prof. Quang Su of BU
REL3A - Modeling and Characterization for Shock and Vibration by Prof. Jame Pitarresi of BU
February Meeting Presentations
By: Martin Anselm, Manager AREA Consortium
By: Michael Meilunas
By: Chris Anglin
By: Jeff Schake (DEK)
Cycling Effect on Laminate Strength
By: Pericles Kondos
By: Harry Schoeller
By: Harry Schoeller
By: Pericles Kondos
By: Yuan Zeng (BU Student Research Associate)
Resonance Tracking Vibration Testing
By: Prof. Quang Su (BU Mechanical Engineering)
By: Michael Meilunas
Modeling and Characterization for Shock and Vibration
By: Prof. James Pitarresi (BU Mechanical Engineering)
Lead-Free Failure Mechanisms in ATC Testing
By: Babak Arfaei
This Presentation includes both sessions of Babak's presentation.
Slow and High Speed Shear Testing of New Alloys
By: Shantanu Joshi (BU Student Research Associate)
By: Prof. SB Park (BU Mechanical Engineering)
Component Level TIM Comparison
By: Harry Schoeller
Fine Pitch Reliability Final Update
By: Michael Meilunas
By: Michael Meilunas
Lead Free Solder Joints in Thermal Cycling
By: Peter Borgesen (BU SSIE Department)
Comparing Lead Free Solder Alloys in Terms of Reliability
By: Peter Borgesen (BU SSIE Department)
Wave Soldering Hole Fill Planning
By: Denis Barbini
Creep Corrosion Update - ENEPIG
By: Pericles Kondos
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